Chip Architectures Becoming Much More Complex With Chiplets The shift to chiplets is surging, with 50% of high-performance computing now multi-die. AI demands 100% chiplet-based designs, fueling new standards and interconnects. Companies race to enhance performance, efficiency, and interoperability in next-gen semiconductors. Semiconductor Engineering

Global IC Fabs And Facilities Report: 2024 The chip industry ramped up investments in 2024, driven by government CHIPS Act funding and private capital. Major projects included new fabs, SiC, GaN, and advanced packaging facilities. Amkor and TSMC collaborated to enhance supply chain resilience, prioritizing national security. Semiconductor Engineering

MRSI (Mycronic), a US-based industry leader in high-precision chip and die assembly solutions, has encountered challenges due to the US ban on advanced semiconductor production in China. Our expertise is in providing state-of-the-art assembly solutions to industries like photonics, aerospace, and defense, among others. The ban ... MRSI, Mycronic

The U.S. Will Start Manufacturing Advanced Chips TSMC will begin mass production at its Arizona semiconductor fab in 2025, marking a pivotal U.S. chip manufacturing milestone. The advanced facility aims to stabilize global supply chains while overcoming cultural, technical & workforce challenges under the CHIPS Act's $6.6 billion funding. IEEE Spectrum

Chip Architectures Becoming Much More Complex With Chiplets The shift to chiplets is surging, with 50% of high-performance computing now multi-die. AI demands 100% chiplet-based designs, fueling new ... Semiconductor Engineering

TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. With fresh investments from OSAT providers, IDMs, and new players, traditional industry roles face significant disruption. Digitimes

Chip Industry Week In Review Summary Global semiconductor sales soared 20.7% in November 2024, hitting $57.8 billion. Innovations like Imec's GaAs laser diode and Micron's HBM facility drove growth, while investments in 3D packaging and AI reshaped the market amid supply chain challenges. Semiconductor Engineering Read the Full Article The dedicated team at Semiconductor Packaging News has ...

The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges ...

A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech ...

Samsung accelerates IC manufacturing with advanced packaging automation, aiming to enhance production efficiency. The tech giant has announced plans to implement cutting-edge automation technologies in its chip manufacturing process, streamlining operations and reducing human intervention. This move ...