A new technical paper titled “Advanced Chiplet Placement and Routing Optimization considering Signal Integrity” was published by researchers at KAIST. Abstract: “This article addresses the critical ...

An Assessment Model of Real-World Hardware Security Attacks” was published by researchers at TU Wien and TÜV Austria. “We ...

How in-design analysis helps engineers catch and fix SI/PI challenges early, saving time, reducing risks, and ensuring ...

Predictive modeling, strategic sampling and embedded monitors help accelerate testing for yield limiting defects.

SCALINX, a fabless semiconductor company specializing in the design of system-on-chip (SoC) devices, was looking to develop a ...

A new technical paper titled “Hardware-based Heterogeneous Memory Management for Large Language Model Inference” was ...

According to the researchers, the platform can achieve wafer-scale integration of all the devices required to build an ...

The 2D Materials Roadmap Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University of Manchester, University of Cambridge et al.

Data sharing becomes more challenging when AI and multi-die assemblies are involved.

Note: all measurements made with and without temperature.