Tungsten has a Young's modulus of 407 GPa, a yield stress of 1.516 GPa, and a UTS of 1.516 GPa. The linear coefficient of thermal expansion is 4.59 m/m/K and the thermal conductivity is 1.73 W/cm/K.

Synthetic diamond specialist Element Six, part of the De Beers Group (think diamond jewelry), said more than half of all electronic device failures today are heat-related.

Its atomic radius is 0.197 nm. At room temperature Calcium has a face-centered cubic crystal structure with a = 0.556 nm. The linear coefficient of thermal expansion is 22.32 m/m/K and the thermal ...

several new polymer composite substrate material systems with high thermal conductivity, low thermal expansion coefficient, and low dielectric constant can be obtained, as well as the optimized design ...

Thermal Conductivity,Thermal Resistance,Effective Thermal Conductivity,Heat Sink,Heat Transfer,Heat Flux,Heat Source,Heat Transfer Coefficient,High Bandwidth Memory,Thermal Challenge,3D ...

Specialists at JSC NIIEFA and MISIS have developed a composite of tungsten and copper, using additive technologies, for the ...

Lazaro Calderin et al. have programmed a new code with similar capabilities for newer versions of Quantum Espresso and compatible with PAW pseudopotentials. Here:http ...