Luke is reviewing the new AMD Ryzen 7 5800X3D processor. Featuring AMD's 3D V-Cache technology, Luke finds out exactly what ...

The low-cost, scalable technology enables seamless integration of high-speed gallium nitride transistors onto a standard ...

Innovative power supply technology for 3D-integrated chips improves energy efficiency and reduces noise, addressing the ...

Wafer-scale accelerators for AI applications can deliver far more computing power with much greater energy efficiency.

A novel structured light based omnidirectional 3D camera was developed, which consists of a projector, a camera, and two hyperbolic mirrors. Compared with traditional single-directional 3D sensors, ...

NVIDIA has released a safety platform for robotics developers and updated its simulation, AI, and autonomous vehicle ...

The Children’s Museum of Indianapolis. While there are several children’s museums that have climbing gyms, tot-scaled ...

Keeping cool and comfortable all summer long is no easy feat, but the best cooling products, from sheets to fans, can help you conquer summer heat waves.

For those who thought Omni-Path was dead and brain-dumped all memories of it, here's a quick refresher. Initially developed by Intel in 2015, Omni-Path is a lossless interconnect technology, similar ...

As a result, even at 42°C with high humidity, the body experiences far greater heat stress, often equivalent to 47–50°C. This “feels like" measure reflects the true physical strain on the human body.

The three dimensional system in package (3D-SiP) has been regarded as a promising solution to the scaling limit problem in the semiconductor industry. Practical realization of the 3D-SiP needs ...