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Tom's Hardware on MSNIntel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidthIntel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...
A significant fraction of their energy consumption results from off-chip memory accesses. In order to get high throughput, these accelerators connect to off-chip memory by a wide data bus. However, ...
Magillem Registers is all about speeding up the design of hardware-software interfaces in complex, large-scale SoCs.
Nvidia CEO Jensen Huang sets out his future vision at Computex 2025Nvidia looks to move into building large scale AI ...
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