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Tonight, clouds will steadily increase, casting a quiet but moody sky overhead. While most of the evening will stay dry, ...
Center for Advanced Research of Energy and Materials, Faculty of Engineering, Hokkaido University, N13 W8, Kita-ku, Sapporo 060 8628, Japan, and Graduate School of Energy Science, Kyoto University, ...
† Department of Solid State Sciences, COCOON, Ghent University, Krijgslaan 281/S1, 9000 Ghent, Belgium, ‡ Laboratory for Chemical Technology, Ghent University, Krijgslaan 281/S5, 9000 Ghent, Belgium, ...
The 3D channel stacking integration particularly employs a low-temperature (200 °C) hetero-layers bonding technique (LT-HBT) realized by a surface activating chemical treatment at room temperature, ...
Abstract: Pressureless low temperature Cu–Cu bonding by sintering Cu nanoparticle (NP) paste is a promising method to realize die attachment in power electronics and third-generation semiconductor ...
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