Apple chipmaker TSMC says that it will make chips with a sub-2nm process size for the first time ever in 2028, and that the development of 1.4nm chips will allow for greater AI capabilities.

The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

Complexity, uncertainty, and lots of moving pieces will challenge the semiconductor industry for years to come.

Infineon Technologies AG is responding to the growing demand for high-voltage automotive IGBT chips by launching a new ...

Taiwan Semiconductor Manufacturing Co on Wednesday unveiled technology for making faster chips and putting them together in ...

We're creeping up on the five-year anniversary of Tim Cook's Apple Silicon announcement, and over a decade of rumors. Here's ...