The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...

UMass Amherst researchers have developed a laser-based holographic alignment method that could revolutionize overlay accuracy in semiconductor manufacturing, though its industrial adoption may hinge ...

On Tuesday, the British rocker released the cinematic video for his lengthy single “Hello Heaven, Hello,” which introduces his first album in three years. “’Hello Heaven, Hello’ is the ...

But the test wafers suggest that Intel is on pace, or maybe even a bit ahead of schedule, for producing 1.8nm-class chips in the middle of this year. If Intel can prove wrong the rumors about it ...

TechPowerUp, citing Intel’s engineering manager Pankaj Marria, reports that initial 18A wafers are already rolling out from the Arizona plant. The progress, according to ijiwei and Commercial Times, ...

Another interesting trend according to Fischer is the increased market share of rectangular wafers both in the 182mm size (M10R) and 210 mm size (G12R). “This is interesting to see, especially ...

The 27-year-old British rocker introduced his fourth studio album era with an epic nine-minute long single, “Hello Heaven, Hello” as well as the accompanying cinematic music video on Tuesday ...

Initial 2nm wafers will arrive at TSMC's Hsinchu plant in April. Production capacity is expected to reach 50,000 wafers monthly by year-end. TSMC's bleeding-edge 2nm process node technology is ...