Abstract: Achieving precise localization in industrial settings presents significant challenges due to dynamic movements, complex layouts, and harsh environmental conditions that cause signal ...
Elimination of Pinhole Defects in Self-Aligned Double Patterning Process by using Bias Pulsed Plasma
Abstract: Self-aligned double patterning (SADP) is extensively utilized in advanced sub-20nm technology nodes. The DRAM digit contact SADP dry etch process experienced severe yield loss due to pinhole ...
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