Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new ...

Innovative power supply technology for 3D-integrated chips improves energy efficiency and reduces noise, addressing the ...

Wafer-scale accelerators for AI applications can deliver far more computing power with much greater energy efficiency.

A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked ...

The latter has an arm reach of 1,000 millimeters that picks the wafers from the cassettes and places them reliably and accurately into the few hundred micrometers larger carbon fiber nests of the ...

EFEM Integrated with Nano-Level Precision Stage The demo started at the point where a cassette of wafers was delivered to the EFEM module. The EFEM detects the wafer cassette position via sensors.

WTF?! A Reddit user claims to have discovered an entire 12nm TSMC wafer discarded in a dumpster near one of the chipmaker's fabs in China. While it was just a test wafer, the find sparked jokes ...

The company will transfer wafer production from the Miyazaki plant of its subsidiary Sumco Techxiv to other manufacturing facilities, as it restructures the production for silicon wafers of 200mm ...

similar to the thin silicon wafers used to build modern computer chips, which have proved tricky to create. Now, Zhiqin Chu at the University of Hong Kong and his colleagues have found a way to ...

The robotic arm is able to lift a wafer from a wafer cassette and move it freely in the x-y plane ... and a wafer notch detection and alignment system using a computer vision algorithm. Future ...