It affects power, performance, and cost on a macro level, and the basic functionality of all ... monolithic 3D ICs, advanced substrates, novel materials. Overall an in-depth benchmark analysis ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping ... that enable the transformation of 2D-ICs into 3D-ICs using shuttle chips from ...