An Assessment Model of Real-World Hardware Security Attacks” was published by researchers at TU Wien and TÜV Austria. “We ...

Predictive modeling, strategic sampling and embedded monitors help accelerate testing for yield limiting defects.

A new technical paper titled “Advanced Chiplet Placement and Routing Optimization considering Signal Integrity” was published by researchers at KAIST. Abstract: “This article addresses the critical ...

How in-design analysis helps engineers catch and fix SI/PI challenges early, saving time, reducing risks, and ensuring ...

According to the researchers, the platform can achieve wafer-scale integration of all the devices required to build an ...

SCALINX, a fabless semiconductor company specializing in the design of system-on-chip (SoC) devices, was looking to develop a ...

A new technical paper titled “Hardware-based Heterogeneous Memory Management for Large Language Model Inference” was ...

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; ...

Data sharing becomes more challenging when AI and multi-die assemblies are involved.

Note: all measurements made with and without temperature.

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, bonding, and advanced debug.