Challenges include probing fine-pitch micro-bumps and maintaining test access throughout 3D stacks. Solutions include ...

ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged ...

If PCBs aren’t tested, errors and defects missed during the manufacturing process could eventually lead to malfunctions and product failures in the field. After a PCB board is manufactured and ...