Apple might stick to using TSMC's third-generation process node (N3P) for the A20 chips powering the iPhone 18 in 2026.

Credit: Tom's Hardware While the whole market was looking at the appointment of Lip-Bu Tan as Intel chief executive, there ...

MIMOS Berhad and SensoremTek Sdn Bhd have signed a strategic cooperation agreement to strengthen the country's semiconductor industry through the production of high-tech MEMS (Micro-Electro-Mechanical ...

Malaysia’s semiconductor sector sees a boost with ARM’s US$250M investment, aiming for high-value chip design and advanced ...

Individual EUV photons have a lot of energy, but there aren’t very many of them. Feature roughness depends on the interaction ...

Muddy Buddies are a no-bake snack mix with fewer than 10 ingredients! They're sweet, crunchy, and perfect for Easter baskets ...

For now, the company is running test wafers to ensure that the fabrication process transfer is a success, but eventually the fab will start running actual chips for commercial products.

Malaysia Semiconductor Industry Association president Wong Siew Hai also said there was a "shortage of those suitable for the ...

With billions of transistors inside each smartphone application processor, having these patterns appear on the wafer without ...

The product covers a wide range of semiconductor shipments, including integrated circuits, chipsets, microchips, urgent ...