Teradyne Inc. has entered into a definitive agreement to acquire privately held Quantifi Photonics, a leader in photonic IC ...

Knowing where circuits came from, and the conditions in which they operate, can help designers optimize devices already in ...

However, not all chips perform equally, even if they come from the same wafer. This is where chip binning comes in. After dicing, each die is tested and sorted based on factors like speed ...

Mixing financial data with manufacturing analytics can boost efficiency, but there are still pockets of resistance.

Learn more about whether Amkor Technology, Inc. or MACOM Technology Solutions Holdings, Inc. is a better investment based on ...

PIC technology is leveraging wafer-based manufacturing, multi-die integration, and advanced packaging with high-speed I/O interfaces to enable the rapidly evolving high-performance Compute market ...

Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC – Get Free Report) shares reached a new 52-week low during trading on Friday ...

SemiQ’s 1,200-V third-generation SiC MOSFET, in a smaller footprint, reduces switching losses in high power applications.

Wafer-level testing Teradyne says that the deal will enable it to deliver scalable PIC test solutions at a time when PIC ...

Intel's long-serving head of technology development Ann Kelleher will retire later this year, handing off responsibilities to ...

Compound Semiconductor™ is an Angel Business Communications publication.

Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process. To list ...