EV Group unveils new version of its GEMINI automated production wafer bonding system supporting MEMs advancements.
From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...
Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...
Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure The SB6/8e is a semi-automatic, computer ...
EV Group, an Austria-based supplier of equipment and process solutions for semiconductors, showed the next-generation version ...
ST. FLORIAN, Austria, March 18, 2025 /PRNewswire/ -- EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip ...