Inherent voids or defects at the interface between leadframe-pad and the encapsulant become sites of stress concentration which can result in the delamination of interfaces during solder reflow.

Department of Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max-Planck-Str. 1, 40237 Düsseldorf, Germany ...

Author MG is employed by CART Tire Co., Ltd. The remaining authors declare that the research was conducted in the absence of any commercial or financial relationships that could be construed as a ...