Abstract: We proposed a new type of transverse electric (TE) polarized mode-order converter based on a deeply-etched polygonal slot on a silicon-on-insulator waveguide. Along the transverse direction ...

Abstract: Chiplet-based packaging technology integrates multiple heterogeneous dies with different functions and materials into a single system as a LEGO-based approach using advanced packaging ...

Department of Electronic Materials Engineering, Research School of Physics and Engineering, Australian National University, Canberra, Australian Capital Territory 2601, Australia ...

I don’t know about you, but it seems like summer zips by. So since this weekend ushers in the start of June, my wife, ...

Scientists uncovered rare hexagonal silicon forms (2H, 4H, 6H) created by stress and heat, challenging assumptions about this ...

At this week's IEEE ECTC 2025 conference, research hub Imec demonstrated an integrated 300 mm RF silicon interposer platform ...