By leveraging DNA’s self-assembling capabilities, Columbia’s research marks a step toward a future where electronics build ...

These acted like anchors. They then added specially designed DNA pieces that folded into eight-sided shapes called ...

Researchers at Columbia Engineering have for the first time used DNA to help create 3D electronically operational devices ...

The design introduced by this team of researchers entails stacking ten layers of indium oxide (In 2 O 3) thin-film ...

Researchers from Ulsan National Institute of Science and Technology (UNIST) and Pohang University of Science and Technology ...

But when the task at hand is growing oxide layers on silicon chips in preparation for making your own integrated circuits, it turns out that the old Mark 1 eyeball is all you need. Alert readers ...