AMD switch to TSMC marks another setback to Samsung's foundry business, adding to the already low 3nm wafer yields.

Samsung kicked off large-scale runs of its HBM3E 12Hi stacks in early 2025, with the first wafers landing in February. Each stack packs twelve memory layers for a cool 36 GB of capacity.

Intel Foundry Direct Connect 2025 took place this week in San Jose, California, and the company reported progress on its ...

Those chips will be used in Galaxy devices - but they may not be ready in time for the Galaxy S26 launch. It seems that ...

Samsung Electronics Co., the world’s leading memory chipmaker, is in talks to supply customized sixth-generation ...

By Ozan Ergenay (Reuters) -German semiconductor materials supplier Siltronic on Wednesday cut its 2025 core profit margin forecast but confirmed full-year sales guidance, saying it is not yet possible ...

Samsung Electronics reported its financial results for the first quarter of 2025, revealing revenue of KRW79.1 trillion ...