The Precision Machines division includes dicing saws, laser saws, grinders, polishers, wafer mounter, die separator, surface planer, and water jet saws. The Precision Processing Tools offers ...
A new solid-state laser produces 193-nm light for precision chipmaking and even creates vortex beams with orbital angular ...
The typical high-power ion laser of five ... that cutting LED wafers with YAG lasers at longer wavelengths produces burning around the edge of the cut. And diamond cutting saws can result in ...
It can convert incoming laser light to different colours ... problem came at the end of a razor-sharp saw. After direct bonding a PPLN wafer to a substrate, the team mechanically cut narrow ...
The LF210 Laser Autofocus system from Prior Scientific can be used with a variety of reflective samples, including hard disc drive platens and semiconductor wafers. Shooting a laser beam on the ...
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