To support the rapid growth of electric vehicles, Infineon has introduced a new generation of energy-efficient silicon IGBTs ...

The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

Apple chipmaker TSMC says that it will make chips with a sub-2nm process size for the first time ever in 2028, and that the development of 1.4nm chips will allow for greater AI capabilities.

Complexity, uncertainty, and lots of moving pieces will challenge the semiconductor industry for years to come.

Infineon Technologies AG is responding to the growing demand for high-voltage automotive IGBT chips by launching a new ...

Taiwan Semiconductor Manufacturing Co on Wednesday unveiled technology for making faster chips and putting them together in ...

We're creeping up on the five-year anniversary of Tim Cook's Apple Silicon announcement, and over a decade of rumors. Here's ...

GlobalFoundries (Nasdaq: GFS) (GF) today announced it will accelerate its near-term greenhouse gas (GHG) emission reduction goals, enhancing the company’s commitment to sustainable operations and ...

The chips help electric vehicles use less energy, go farther, and save costs, making them more efficient and eco-friendly.

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; ...

The 1200 V RC-IGBT elevates performance by integrating IGBT and diode functions on a single die, delivering an even higher ...

In response, Infineon Technologies is developing a new generation of high-voltage automotive IGBT chip products. Among these ...