CLINTON, NY – Indium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in ...

The solder bumps can be 0.6mm in diameter and placed on 1mm center to center. 2. Points of Failure: BGA Solder Joints The following is a list of some points of failure associated with FPGAs in BGA ...

A traditional SAC reflow profile is used for soldering, which results in a homogeneous SAC-LTS solder joint. This process contrasts with the conventional “LTS Hybrid” approach, which uses LTS paste ...