This is particularly critical in power devices where multiple materials such as dies, die attach, wires, and lead frames are molded together. If delamination occurs ... weakening the adhesive ...

As more semiconductor packages are used in automotive applications, it is increasingly important the package has zero delamination ... leadframe (LF), solder (die attach), aluminum (Al) wire ...

Due to its unique properties, YINCAE die attach adhesive has a high thermal conductivity and ... and can withstand extreme temperatures ( -273°C) without any delamination. The Global Technology Awards ...

Venkat Nandivada, Manager of Technical Support at Master Bond Inc, talks to AZoM about die attach adhesives used in semiconductor ... As the die bonder places the die on the adhesive, it adds a slight ...

Focussing on stacked die packages, QMI 9503 thermally-conductive dielectric adhesive can secure ICs ... It also exhibits high resistance to delamination and popcorning after multiple exposures ...

The 165 W/m-K ultra-high thermal conductivity die attach adhesive has demonstrated excellent sintering properties with good adhesion on copper (Cu), pre-plated (PPF), silver (Ag), and gold (Au ...

The QMI 519 is a silver-filled, electrically and thermally conductive adhesive used to attach ICs and components ... will offer high resistance to delamination and popcorning, even after exposure ...