This issue has been resolved through the finite element analyses by cooperating into the residual strain (stress) in the epoxy molding compound (EMC) of the package, which is obtained by measuring the ...

Abstract: 2.5D multichip module packaging technology for higher end devices like CPU, GPU, 3D NAND flash memory and High Bandwidth Memory (HBM) require two major molding process solutions: higher ...

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The microfactory has retained its status as being the next big thing in manufacturing. Potentially. A microfactory uses 3D printers to make big products close to customers, allowing them to cut ...