Aluminum nitride (AlN) and silicon carbide (SiC) are both high-performance engineering ceramic materials, but there is a ...
This innovative solution is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications. The new test ...
A team of engineers at Fudan University has successfully designed, built and run a 32-bit RISC-V microprocessor that uses ...
Tech Xplore on MSN1d
New approach reliably integrates 2D semiconductors with dielectricsTwo-dimensional (2D) semiconductor materials could enable the development of smaller yet highly performing electronic ...
Interesting Engineering on MSN1d
World’s first light-based chip offers 50x speed, 30x efficiency over siliconQ.ANT announces production of its revolutionary light-powered AI chip, promising 50x faster speeds and 30x better energy ...
The Sacramento Kings made a late push but ultimately came up short on Wednesday against the Washington Wizards, falling 111-116 on the road in a game that was frankly painful to watch for long ...
Interesting Engineering on MSN1d
World’s most complex 2D, one-nanometre thick semiconductor chip developed in ChinaDeveloped by China's RiVAI Technologies, the Lingyu CPU supports high-performance computing like large open-source language ...
On March 22, the JFS Laboratory research team in Wuhan, Hubei province, announced the world's first successful fabrication of 8-inch N-polar GaN-on-insulator (GaNOI) wafers on silicon substrate. This ...
[SINGAPORE] United Microelectronics Corporation (UMC) on Tuesday (Apr 1) launched its newest wafer fabrication facility to produce semiconductor wafers. This latest facility – about 60 per cent larger ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback