An Assessment Model of Real-World Hardware Security Attacks” was published by researchers at TU Wien and TÜV Austria. “We ...

A new technical paper titled “Advanced Chiplet Placement and Routing Optimization considering Signal Integrity” was published by researchers at KAIST. Abstract: “This article addresses the critical ...

Predictive modeling, strategic sampling and embedded monitors help accelerate testing for yield limiting defects.

How in-design analysis helps engineers catch and fix SI/PI challenges early, saving time, reducing risks, and ensuring ...

SCALINX, a fabless semiconductor company specializing in the design of system-on-chip (SoC) devices, was looking to develop a ...

A new technical paper titled “Hardware-based Heterogeneous Memory Management for Large Language Model Inference” was ...

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

According to the researchers, the platform can achieve wafer-scale integration of all the devices required to build an ...

Data sharing becomes more challenging when AI and multi-die assemblies are involved.

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; ...

Note: all measurements made with and without temperature.

Semiconductor Engineering has compiled a comprehensive list of the types of packages, what’s included in them, and various ...