Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package. THIS DEFINITION IS FOR ...

Au and Al Wire Bonding, SMT, assembly of Optical Components, Box-Build, 3D integration. In the field of optoelectronics, AEMtec and Dutch optics specialist Anteryon are now collaborating to provide ...

According to an ordinance adopted unanimously by the assembly during their Jan. 21 meeting ... projects that were part of the 2022 School Bond package.” Because the scope of that work includes ...