It then instructs the tester to test one or more dies and collects the binning results, before stepping onto the next die. This is repeated for the whole wafer, and each wafer in the cassette.

NORTH READING, Mass., March 31, 2025--(BUSINESS WIRE)--Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics ...

a global leader in production solutions for photonics assembly and test, to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics.

Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the ...

This innovative solution is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications. The new test ...