More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

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IC manufacturers have yet to fully optimize the high-volume manufacturing cost structure for the 300mm wafer size. However, the potential per-die cost savings that the larger wafer can provide is ...

These companies offer the types of ICs that benefit most from using the largest wafer size available to best amortize the manufacturing cost per die. Moreover, they have the means to continue ...