From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group); Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID); Dr. Manuela Junghähnel ...

only this time will they be constructed on one side of the glass wafer, requiring a new production method. The patent also ...

They are “particularly suitable for neuromorphic systems and used in machine learning, deep learning, and cognitive computing.” The orthorhombic structure is prone to decay compared with the stable ...

How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...

The new bonding equipment can be used for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. It is designed for production as well as process development. Configurable ...

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...

YMTC introduced hybrid bonding technology four years ago and expanded its patent portfolio by acquiring rights from US-based firm Xperi. Unlike Samsung's existing method, YMTC’s Wafer-to-Wafer ...

Temporary bonding (TB) and debonding (DB) of wafers have been widely developed and applied over the last decade in various wafer-level packaging technologies, such as package-on-package (PoP), fan-out ...