The device is fabricated using a proprietary STtechnology called "VENSENS" that allows the pressure sensor to be fabricated ona monolithic silicon chip. Manufacturing the device in this way ...

Wafer-to-wafer bonding has become an enabling semiconductor technology in industries such as 3D packaging, MEMS ... established in 1990, Sensor Products Inc. is a world leader in the manufacture and ...

Over the years, permanent wafer bonding has been a game changer for several applications in the semiconductor world. In radio-frequency (RF) applications, MEMS, and even for CMOS image sensors ...

Metal-based wafer bonding (Eutectic, Transient-Liquid-Phase and Thermo-compression) plays an essential role in the manufacture of these MEMS devices by enabling hermetic sealing and pressure or ...

Also, as wearables and the healthcare industries now turn to ultra-low-power devices with a smaller footprint, this only increases the pressure ... on at the package, wafer, and die levels, ...

and sensor components will require not only improved performance, but also more economical packaging. A Pillbox Process Key to the new way of packaging is a wafer-scale approach, wherein a MEMS ...

Key material types like UV-curable and thermoplastic adhesives address diverse needs in MEMS, 3D packaging, and wafer-level ... chips and sensor-rich devices, temporary bonding solutions that ...

MEMS sensors made of crystalline silicon are first manufactured separately. Then they are contacted with the circuit via wire and solder connections or wafer bonding processes. “But conventional ...

Pressurex® film from Sensor Products Inc. is a way to detect and correct pressure variations ... Wafer-to-wafer bonding has become an enabling semiconductor technology in industries such as 3D ...

Metal-based wafer bonding (Eutectic, Transient-Liquid-Phase and Thermo-compression) plays an essential role in the manufacture of these MEMS devices by enabling hermetic sealing and pressure or vacuum ...