From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

EV Group unveils new version of its GEMINI automated production wafer bonding system supporting MEMs advancements.

EV Group, an Austria-based supplier of equipment and process solutions for semiconductors, showed the next-generation version ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and lower substrate heaters and precise programmable force control during the wafer ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates ...

G-ray struck upon a wafer-to-wafer direct covalent bonding approach that opened a broad range of applications covering a wide range of industries. The upshot is that G-ray is now positioned to ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...