Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

EASI-Studio 3.0, part of the EASI-Tools family, offers designers automated solutions for packaging and deploying IP in a repeatable and reliable manner. EASI-Studio 3.0 provides the ability to capture ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

Eleco Software, the developer of professional 3D ArCon Architect Software, has appointed Sheffield-based Uber for the packaging design brief for its new products. Uber has been tasked with creating ...

Global food product manufacturer Mars Inc. is partnering with Pittsburgh-based engineering software company Ansys in which Mars will adopt simulation software that could “reimagine” its packaging ...

New SPEC (System Plast Engineering Calculator) design software from Emerson Industrial Automation’s Power Transmission Solutions business helps engineers spec and configure chain and modular belt ...

The Fabric Manager software package has been unleashed for emerging InfiniBand designs. Using this software package, design engineers can manage the flowof data through fabrics connecting remote ...