Digital designs have not traditionally suffered by issues associated with transmission line effects. At lower frequencies the signals remain within data characterization and the system performs as ...

In Part 1, we explored the basic characteristics governing high-speed SerDes channels. This article focuses on real-world issues, such as parasitics and impedance mismatches, that require additional ...

To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an ...

Considerations for dividing analog and digital blocks. Decoupling techniques. Breaking down the board layers. How best to deal with grounding. Similar to building a house, it’s essential to create a ...

Signal integrity is a critical design consideration in modern electronic systems, particularly those that depend on high-speed interconnects. As data rates climb and interconnect geometries become ...

Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be much more challenging with chiplets and advanced packaging than in monolithic SoCs ...

As a signal travels across a network, it focuses only on what it sees in its path. And increases in data rates over the past few decades have made this path a bit more clouded. System infrastructure ...