US-based chipmaker GlobalFoundries is preparing a major expansion of its wafer fabrication facility in Dresden, Germany, which is currently the largest such plant in Europe. Citing a report from ...

On August 20, ESMC, a joint venture between TSMC, Robert Bosch, Infineon Technologies, and NXP Semiconductors, held a groundbreaking ceremony for its first semiconductor fab in Dresden, Germany ...

Bosch CEO says US support needed for full expansion of California chip factory The top executive at German technology group Robert Bosch said on Wednesday the company needs subsidies from the U.S ...

Semiconductors N.V. – today held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany. “Together with our partners, ...

TSMC's Dresden Fab worth USD 10.8 billion investment with NXP, Bosch and Infineon will support the European chip industry and create 2,000 high-tech jobs Taiwan Semiconductor Manufacturing Company ...

at Bosch Tech Day 2022 in Dresden, Germany. By 2026, Hartung said Bosch plans to invest another €3 billion in its semiconductor division as part of the funding program on microelectronics and co ...

Bosch’s Christian Koitzsch headed ESMC. EMSC is considering hiring close to 2,000 employees. Taiwan Semiconductor proposes sending hundreds of engineers to Dresden over the next three to five years.

But the bad news inside ... allocations. Bosch has been steadily investing to produce its own chips. One year ago, Bosch opened new semiconductor wafer production capacity in Dresden at a cost ...

Bosch will acquire the assets of U.S. chipmaker TSI Semiconductors to expand its semiconductor business with silicon carbide chips (SiC), the German engineering and technology giant said Wednesday.