Taiwan's Foxconn is among potential bidders for the Singaporean semiconductor assembly and testing business UTAC Holdings in ...

A Terre Haute plant that was originally designed to manufacture CDs in the 1980s is continuing efforts to diversify with a ...

Although semiconductor assembly requires lower precision than ... chips are still assembled with wire bonding techniques, this process and the back-end machines used for it are more commoditized ...

Anthony Paul Bellezza the inventor of a 2D Graphene fusion process being used for CMOS Chip assembly processes, that fuses interconnects at temperatures within the thermal budget of the chip below ...

Last week, India cleared a proposal for a new chip plant to be developed by HCL Group and Taiwanese electronics giant Foxconn ...

The proposed facility would aim to produce more than 100 million System-in-Package (SiP) units annually by 2031, targeting ...

has been a key player in Malaysia's semiconductor landscape for more than 50 years. Ambitious to lead in assembly and packaging, NXP focuses on innovation, process improvements and workforce ...

This event was a key component of the “Advanced Assembly ... R&D strategies and process development, university research and semiconductor education programs, and international student exchange ...

“This acquisition supports our mission to expand U.S. semiconductor ... microelectronic assembly supplier, SMART Microsystems takes complete responsibility for custom process development for ...