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Samsung, Amkor, and TI finalize CHIPS deals: 2nm and advanced packaging coming to U.S.While Samsung Foundry has every reason to celebrate ... Amkor to get $407 million to build an advanced packaging facility The Biden-Harris administration will also provide $407 million in direct ...
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The company is the recipient of ReMA’s 2025 Design for Recycling Award, the association’s “most prestigious honor.” ...
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Revolutionary Samsung tech that enables stacking HBM memory on CPU or GPU arrives this year — SAINT-D HBM scheduled for 2024 rollout, says reportSamsung is set to introduce 3D packaging services for high-bandwidth memory (HBM) this year, according to a report from the Korea Economic Daily that cites the company's announcement at the ...
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