TI’s new isolated power modules use IsoShield packaging to deliver higher power density, smaller footprints, and reinforced ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

The UCC34141‑Q1 and UCC33420 modules use TI’s proprietary IsoShield packaging technology, which integrates a planar ...

DALLAS, July 16, 2024 /PRNewswire/ -- Texas Instruments (TXN) today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage ...

Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" explores the growing power module packaging materials market, driven by the rise of SiC and GaN semiconductors and electric vehicles.

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

The quest for ever-higher power densities has encouraged the rise of breathtaking levels of active/passive device integration and cool-running packaging technology. Advanced packaging technologies are ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...

Texas Instruments (TI) today unveiled new isolated power modules, helping enable increased power density, efficiency and ...