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Future AMD Ryzen SoCs Could Utilize a New Overlapping Chip-Stacking Design, According to a Newly Discovered Patent Filing - MSNA new patent suggests that future AMD Ryzen SoCs will utilize a package design featuring a large die stacked on top of ...
Pentair Technical Products announces an enhanced single-handle design for Hoffman PROLINE® Overlapping Doors. The overlapping doors feature a master door to ensure a dust-tight seal with a three-point ...
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