Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...

SK hynix said Thursday it has developed a mobile universal flash storage (UFS) chip based on the world's highest 321-layer 1 ...

SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's ...

South Korean chipmaker SK hynix said Thursday it had developed a universal flash storage chip integrating the world’s highest ...

It will only be available in 512GB and 1TB capacities, which can cause problems down the line. Memory maker SK hynix has ...

Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 layers into its latest NAND chips, making its new UFS 4.1 modules thinner, ...

San Jose, California - May 13, 2011 - Arasan Chip Systems, Inc. ("Arasan"), a leading ... memories is accompanied with the corresponding increase in memory controller complexity. Arasan's NAND Flash ...

The late 1990s saw the widespread introduction of solid-state storage based around NAND Flash. Ranging from memory cards for portable ... even if it allowed the chip to be rewritten thousands ...

Samsung to release 400-layer NAND chip for ... the NAND flash market with its cutting-edge V10 NAND, designed to meet surging demand in AI data centers. The company’s memory roadmap, as outlined ...