Dimensions Consulting Inc. (DCI) has announced a new surface-mount BGA test socket for use with high speed Serdes applications operating beyond 10 Gbps. In addition, the company announced a test ...

Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...

Aries Electronics chose Wescon (Santa Clara, CA, April 12-14, www.wescon.com) to highlight a new test and burn-in socket as well as a new RF socket. The company's new test and burn-in socket ...

The company's interposer, Spring Probe and Microstrip Contact RF test sockets are now available with thermoelectric cooling, reportedly eliminating the need for other, more costly methods of thermal ...

Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...