The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

This shift comes as HBM and chip-on-wafer-on-substrate (CoWoS ... and development of next-generation alternatives. Among these, glass substrates are gaining traction as a breakthrough solution.

The company uses these systems for research and development purposes, and so far, Intel has processed tens of thousands of wafers using them ... aspects (such as glass for photomasks, pellicles ...

The transfer device consists of a network of glass chambers in which graphene ... from the copper and transfer it to a production wafer previously aligned with the chambers. The whole process ...

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

For the new G12 wafers, the new price is RMB5.60 per piece. Longi priced its p-type M6 (166x223mm, 175um thickness) monocrystalline wafer at RMB3.35 per piece while, for the G1 size (158.75x223mm ...