Using these proprietary NoC techniques for on-chip communications results can help meet project specifications, reduce project risk, speed time-to-market, and improve SoC economics when compared ...

By leveraging the advanced functionality of EDA reliability verification tools to automate a variety of complex verification processes within every stage of the design from schematic and layout ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University. Abstract ...

Winbond currently supplies half of HannStar’s LCD driver ICs. Winbond projects volume production of LCD TV driver ICs in 4Q HannStar has already booked 80% of Winbond’s total LCD TV driver ...