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Tech Xplore on MSNNew 3D integrated metal-oxide transistors to fabricate compact and high density electronicsThe innovative transistor design introduced in this recent paper was so far used to develop high-performance and high-density ...
covering US patent properties entitled “High Density Growth of T7 Expression Strains with Auto-Induction Option,” filed March 14, 2003, in the name of F. William Studier and assigned to ...
More than 5000 fully customizable cells are available, and each one has been optimized for speed, routability, power and density, in order to maximize performance and wafer yield while lowering ...
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