One answer to this is advanced chip packaging. The semiconductor advanced packaging market has an expected CAGR of 8.5% between 2023 and 2027. To succeed in this growing market, there’s a need ...

The global advanced packaging market has experienced growth due to several factors such as an increase in demand for miniaturization and expansion of the consumer electronics sector. The notable ...

Notably, Silicon Box facilities specialize in advanced chiplet integration capabilities ("advanced packaging"), on a large manufacturing format for scale. The chiplet concept is an alternative to ...

Taiwan Semiconductor Manufacturing Co. and Arizona authorities are talking about adding advanced chip packaging capacity to the company’s plants in the state, Governor Katie Hobbs said in Taipei ...

Expansion plans for the Singapore factory reflect the severe current shortage in advanced packaging solutions, and Silicon Box's commitment to enabling AI accelerator solutions and bringing them ...

The US Commerce Department is launching a $3 billion program to stimulate the domestic chip-packaging industry, a key link in the semiconductor supply chain that Washington worries has become ...